Method for producing a printed circuit board with an embedded sensor chip, and printed circuit board

Abstract

A method for producing a printed circuit board (10) having at least one embedded sensor chip (3), in which at least one sensor face (5) and terminals (4) are arranged on a face of the chip, said method comprising the following steps: a) providing an adhesive film (1), b) printing a conductor structure (2) formed from a conductive paste onto a surface of the adhesive film, c) placing the at least one sensor chip (3) with the face comprising the at least one sensor face (5) and the terminals (4) onto the conductor structure (2) formed from a conductive paste, in an indexed manner, d) curing the conductive paste, e) applying an insulation layer (6) having a conductor layer (7) arranged thereabove to the surface of the structure, created in the previous steps, comprising the chip (3), f) laminating the structure created in the previous steps, g) structuring the conductor layer (7) and forming vias (9) from the conductor layer to conductive tracks (7b, 7c) of the conductor structure on the surface of the adhesive film, and h) removing the adhesive film (1).

Dependencies are inferred from the claim text.