Method for manufacturing a multilayer structure for hosting electronics

A method for manufacturing a multilayer structure, comprising:

• obtaining a first substrate film for accommodating electronics, the first substrate film having a planar shape including a first side and an opposite second side, the first substrate film comprising an electrically insulating material;
• providing at least on electronic component and at least one conductor on at least the second side of the first substrate film, the at least one electronic component being functionally connected to the first side of the first substrate film;
• thermoforming the first substrate film to at least locally or more widely exhibit a selected non-planar three-dimensional shape subsequent to providing the at least one electronic component on the at least the second side of the first substrate film;
• and
• molding plastic material on the first side of the first substrate film so as to at least partially cover the first side of the first substrate film.