Resin board structure and method for fabricating the same

A resin board structure comprising:

• a first member including a first metal film and including one thermoplastic resin layer or a stack which includes two or more thermoplastic resin layers;
• and
• a second member including a second metal film;
• wherein
• the first metal film and the second metal film are bonded together, at least a portion of the first metal film and at least a portion of the second metal film overlap each other, the first metal film and the second metal film being metallurgically bonded at an interface between the first metal film and the second metal film;
• the first member includes a first junction resin covering portion defined by a portion of a thermoplastic resin layer and overlapping a portion at which the first metal film and the second metal film overlap each other;
• a first protective film is provided over a surface of the first junction resin covering portion, the first protective film including an uneven surface including unevenness to reduce or prevent slippage due to ultrasonic vibration;
• the second member includes a second junction resin covering portion including a portion of a thermoplastic resin layer and overlapping a portion at which the first metal film and the second metal film overlap each other;
• and
• the second junction resin covering portion includes an uneven surface including unevenness to reduce or prevent slippage due to ultrasonic vibration.

A method for fabricating a resin board structure, the method comprising:

• preparing a first member including a first metal film and one thermoplastic resin layer or a stack which includes two or more thermoplastic resin layers, the first member including a first junction resin covering portion defined by a portion of a thermoplastic resin layer and overlapping the first metal film, the first junction resin covering portion including an uneven surface including unevenness to reduce or prevent slippage due to ultrasonic vibration;
• preparing a second member including a second metal film;
• disposing the first member and the second member such that at least a portion of the first metal film and at least a portion of the second metal film are in contact with each other and overlap each other;
• and
• bonding the first metal film and the second metal film together by application of relative ultrasonic vibration between the first metal film and the second metal film.

A method for fabricating a resin board structure, the method comprising:

• preparing a first member including a first metal film and including one thermoplastic resin layer or a stack which includes two or more thermoplastic resin layers, the first member including a first junction resin covering portion defined by a portion of a thermoplastic resin layer and overlapping the first metal film;
• preparing a second member having a second metal film;
• disposing the first member and the second member such that at least a portion of the first metal film and at least a portion of the second metal film are in contact with each other and overlap each other;
• and
• bonding the first metal film and the second metal film together by application of relative ultrasonic vibration between the first metal film and the second metal film;
• wherein
• the first member includes a first protective film covering a surface of the first junction resin covering portion, the first protective film including an uneven surface including unevenness to reduce or prevent slippage due to ultrasonic vibration.