Electrically conducting assemblies

A process for the manufacture of a multilayer assembly, said process comprising:

• applying a patterned layer (LMP) of at least one patterned substrate directly onto a non-patterned layer (LMT) of at least one non-patterned substrate, thereby providing a multilayer assembly, wherein:
• (1) the at least one patterned substrate is obtained by a process comprising:
• printing a liquid composition (L1) comprising at least one first metal compound (M1) onto at least one surface of an optically transparent substrate layer (LT-1) having an outer surface and an inner surface to form a patterned layer (LMP), thus providing a patterned substrate,
• optionally, contacting the patterned layer (LMP) with a liquid composition (L2) comprising at least one second metal compound (M2), said compound (M2) being equal to or different from the compound (M1), and
• drying the patterned substrate, optionally contacted with composition (L2), at a temperature of at least 50° C.;
• and wherein
• (2) the at least one non-patterned substrate is obtained by a process comprising:
• optionally, treating by a radio-frequency glow discharge process in the presence of an etching gas, at least one surface of an optically transparent substrate layer (LT-2) having an outer surface and an inner surface, said layer (LT-2) being equal to or different from layer (LT-1),
• contacting optionally treated layer (LT-2) with a liquid composition (L3) comprising at least one optically transparent metal compound (Mot), to form an optically transparent non-patterned layer (LMT), thus providing a non-patterned substrate, and
• drying the non-patterned substrate at a temperature of at least 50° C.