Packaged semiconductor device having a shielding against electromagnetic interference and manufacturing process thereof
AssigneeSTMicroelectronics S.r.l.
InventorFederico Giovanni Ziglioli
Life of this patent
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Abstract
A packaged device has a die of semiconductor material bonded to a support. An electromagnetic shielding structure surrounds the die and is formed by a grid structure of conductive material extending into the support and an electromagnetic shield, coupled together. A packaging mass embeds both the die and the electromagnetic shield. The electromagnetic shield is formed by a plurality of metal ribbon sections overlying the die and embedded in the packaging mass. Each metal ribbon section has a thickness-to-width ratio between approximately 1:2 and approximately 1:50.
Claims18
A device comprising:
- a support that includes a recess delimited by a base portion and first and second sidewalls;
- an interference shield that includes:
- a conductive grid having a base in the base portion of the support, the base being exposed at a surface of the support, the conductive grid including a first vertical region in the first sidewall and a second vertical region in the second sidewall, the first and second vertical regions being coupled to the base;
- and
- a ribbon section coupled to the first vertical region at a first end and coupled to the second vertical region at a second end, the ribbon section having a curvature such that a length of the ribbon section is greater than a length of the surface of the conductive grid at the surface of the support, wherein the ribbon section and the conductive grid form an electromagnetic shield;
- and
- a semiconductor die located in the recess and enclosed by the interference shield, wherein the semiconductor die is between the base and the ribbon section, and wherein a portion of the semiconductor die is between the first vertical region and the second vertical region.
A method, comprising:
- forming a support that includes a recess and a conductive grid around the recess, a surface of the conductive grid being exposed at a surface of the support;
- positioning a first semiconductor die in the recess;
- and
- providing a shielding ribbon, wherein the shielding ribbon is coupled to the conductive grid, the shielding ribbon having a length this is greater than a length of the surface of the conductive grid at the surface of the support, the shielding ribbon and the conductive grid forming an electromagnetic shield.
A device, comprising:
- a support including a recess, a conductive grid in the support and around the recess, a surface of the conductive grid being exposed at a surface of the support;
- a semiconductor die in the recess and coupled to the support;
- and
- a shielding ribbon coupled to the surface of the conductive grid that is exposed at the surface of the support, the shielding ribbon having a length this is greater than a length of the surface of the conductive grid at the surface of the support, the shielding ribbon and the conductive grid forming an electromagnetic shield.
Dependencies are inferred from the claim text.