Grid array pattern for crosstalk reduction

A printed circuit board (PCB) assembly, comprising:

• a component that sends or receives differential signal pairs;
• a package that is connected to the component;
• and a PCB connected to the package, wherein a set of pads are connected to the package or to the PCB to facilitate a connection between the PCB and the component, wherein the set of pads include a set of package via pads, a set of package grid array (GA) pads, a set of PCB via pads, and a set of PCB GA pads, wherein the set of package via pads are connected to a set of package vias, wherein the set of PCB pads are connected to a set of PCB vias, wherein the set of package vias and the set of PCB vias are to be used to support differential signal pairs that include a first differential signal pair, wherein the first differential signal pair includes:
• a first differential signal that causes crosstalk onto a particular differential signal, of a second differential signal pair, while propagating through a particular package via, of the set of package vias, and a second differential signal;
• wherein a set of interconnects are used to connect package pads to package GA pads or are used to connect PCB pads to PCB GA pads, wherein the set of interconnects includes:
• a first interconnect to route the first differential signal away from the particular differential signal, and a second interconnect to route the second differential signal toward the particular differential signal, and wherein one or more differences in length of the first interconnect with respect to the second interconnect are used to offset one or more differences in a velocity of propagation and cause delay matching of the first and second differential signals.

A package, comprising:

• a set of pads associated with facilitating a connection between a printed circuit board (PCB) and one or more components, wherein the set of pads include a set of via pads and a set of grid array (GA) pads;
• a set of vias electrically connected to the set of via pads and to a set of layers that are perpendicular to the set of vias, wherein the set of vias are to be used to support differential signal pairs and are connected to one or more non-ground layers of the set of layers, wherein the differential signal pairs include a first differential signal pair that includes:
• a first differential signal that causes crosstalk onto a particular differential signal, of a second differential signal pair, while propagating through a particular via, of the set of vias, and a second differential signal;
• and a set of interconnects that electrically connect the set of via pads to the set of GA pads, wherein the set of interconnects includes:
• a first interconnect to route the first differential signal away from the particular differential signal, a second interconnect to route the second differential signal toward the particular differential signal, and wherein the first interconnect traverses through a non-ground layer and the second interconnect traverses through a different non-ground layer, and wherein one or more differences in length of the first interconnect with respect to the second interconnect are used to offset one or more differences in a velocity of propagation and cause delay matching of the first and second differential signals.