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AssigneeLaird Technologies, Inc.
InventorsMohammadali Khorrami, Paul Francis Dixon, George William Rhyne
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According to various aspects, exemplary embodiments are disclosed of board level shields with virtual grounding capability. In an exemplary embodiment, a board level shield includes one or more resonators configured to be operable for virtually connecting the board level shield to a ground plane or a shielding surface. Also disclosed are exemplary embodiments of methods relating to making board level shields having virtual grounding capability. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate by using a board level shield having virtual grounding capability. Further exemplary embodiments are disclosed of methods relating to making system in package (SiP) or system on chip (SoC) shielded modules and methods relating to providing shielding for one or more components of SiP or SoC module.
An assembly comprising a fence and one or more resonators along the fence and configured to be operable for virtually connecting the fence to a grounded electrically-conductive surface without using grounding vias.
Dependencies are inferred from the claim text.