Clamping spring design to apply clamping force to SMT power amplifier device
AssigneePanasonic Automotive Systems Company of America, Division of Panasonic Corporation of North America
InventorGerald A. Tang-Kong
Life of this patent
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Abstract
A power amplifier arrangement for a motor vehicle includes a printed circuit board disposed between a housing on a first side of the printed circuit board and a heat sink on a second side of the printed circuit board. A power amplifier is mounted on the second side of the printed circuit board. A bracket is supported by the housing. A clamping spring is supported by the bracket such that the clamping spring is in biased engagement with the first side of the printed circuit board, and such that the power amplifier is pressed into engagement with the heat sink.
Claims16
A power amplifier arrangement for a motor vehicle, the arrangement comprising:
- a printed circuit board disposed between a housing on a first side of the printed circuit board and a heat sink on a second side of the printed circuit board;
- a power amplifier mounted on the second side of the printed circuit board;
- a bracket supported by the housing;
- and
- a clamping spring supported by the bracket such that the clamping spring is in biased engagement with the first side of the printed circuit board, and such that the power amplifier is pressed into engagement with the heat sink, the clamping spring including:
- a first leaf spring and a second leaf spring, the first and second leaf springs having substantially opposite orientations;
- and
- a rectangular frame having four walls including a first wall and a second wall, the first wall being opposite from the second wall, the first leaf spring being attached to only the first wall of the four walls and being unattached to all other structures, the second leaf spring being attached to only the second wall of the four walls and being unattached to all other structures.
A power amplifier arrangement, the arrangement comprising:
- a printed circuit board disposed between a housing on a first side of the printed circuit board and a heat sink on a second side of the printed circuit board;
- a power amplifier mounted on the second side of the printed circuit board;
- and
- a clamping spring in biased engagement with the first side of the printed circuit board such that the power amplifier is pressed into engagement with the heat sink, the clamping spring including:
- a first leaf spring and a second leaf spring, the first and second leaf springs having substantially opposite orientations;
- and
- a rectangular frame having four walls including a first wall and a second wall, the first wall being opposite from the second wall, the first leaf spring cantilevering from the first wall of the four walls, the second leaf spring cantilevering from the second wall of the four walls.
An electronic device arrangement for a motor vehicle, the arrangement comprising:
- a printed circuit board disposed between a housing on a first side of the printed circuit board and a heat sink on a second side of the printed circuit board;
- an electronic device mounted on the second side of the printed circuit board;
- a bracket supported by the housing;
- and
- a spring device supported by the bracket such that the spring device exerts a force on an area of the first side of the printed circuit board that is opposite a location of the electronic device, the spring device exerting the force such that the electronic device is pressed into engagement with the heat sink, the spring device including:
- a first leaf spring and a second leaf spring, the first and second leaf springs having substantially opposite orientations;
- and
- a rectangular frame having four walls including a first wall and a second wall, the first wall being opposite from the second wall, the first leaf spring being attached to only the first wall of the four walls, the second leaf spring being attached to only the second wall of the four walls.
Dependencies are inferred from the claim text.