Electronic device, socket, and spacer to alter socket profile

An electronic device, comprising:

• a semiconductor package including a semiconductor die;
• a circuit board including a dielectric material;
• a socket coupled to a first side of the circuit board and the socket is configured to receive the semiconductor package;
• a backing plate positioned on a second side of the circuit board;
• a spacer positioned between the backing plate and the circuit board;
• and
• wherein the semiconductor package is received by the socket and is coupled with the socket, and the backing plate has a curved profile, and the curved profile of the backing plate provides a force to the socket by reacting against the spacer.

A method for manufacturing an electronic device, comprising:

• positioning a spacer between a backing plate and a socket;
• coupling the backing plate with the socket or a circuit board;
• and
• wherein the coupling of the backing plate with the socket or the circuit board alters a profile of the socket and provides a curved profile to the socket and displaces a portion of the socket in a first direction.