Microphone unit

A microphone unit comprising:

• a substrate, including
• a first face,
• a second face opposite to the first face, and
• a through-hole extending from the first face to the second face through the substrate:
• a microphone mounted on or fixed onto the second face of the substrate, the microphone having a sound hole in communication with the through-hole of the substrate;
• a fixing member being generally loop-shaped, having an inner size that is larger than a size of the through-hole, and fixed onto the first face of the substrate such as to be located around the through-hole;
• and
• a film providing at least one of dustproofness and waterproofness, the film being fixed onto the fixing member such as to cover the through-hole, wherein
• at least one of the fixing member and the substrate is provided with a vent to connect an inside of the fixing member to an outside of the fixing member, wherein
• the substrate further includes at least one resist layer,
• the at least one resist layer is located at least one of locations (1) and (2):
• (1) on the first face of the substrate and between the first face of the substrate and the fixing member, and
• (2) on the second face of the substrate and between the second face of the substrate and the microphone, and
• the vent is provided in the resist layer.

A microphone unit comprising:

• a substrate, including
• a first face,
• a second face opposite to the first face,
• a through-hole extending from the first face to the second face through the substrate, and
• a first electrode on the first face;
• a microphone mounted on or fixed onto the second face of the substrate, the microphone having a sound hole in communication with the through-hole of the substrate:
• a fixing member fixed onto the first face of the substrate such as to be located around the through-hole, the fixing member including a metal plate fixed to the film and bonded to the first electrode of the substrate with a bonding material;
• and
• a film providing at least one of dustproofness and waterproofness, the film being fixed onto the fixing member such as to cover the through-hole, wherein
• the substrate further includes a resist layer,
• the resist layer is located on the first face of the substrate and between the first face of the substrate and the fixing member and includes:
• a first opening in communication with the through-hole of the substrate,
• a second opening located around the first opening, the first electrode being exposed through the second opening,
• an outer peripheral portion surrounding the second opening, and
• an inner peripheral portion surrounded by the second opening, and
• at least one of the outer peripheral portion and the inner peripheral portion is held by and between the fixing member and the first face of the substrate.