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US 10,455,309 B2Granted
MEMS transducer package
AssigneeCirrus Logic, Inc.
InventorsTsjerk Hoekstra, David Talmage Patten
Life of this patent
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AssigneeCirrus Logic, Inc.
InventorsTsjerk Hoekstra, David Talmage Patten
Estimating the term…
A MEMS transducer package (1) comprises a semiconductor die element (3) and a cap element (23). The semiconductor die element (3) and cap element (23) have mating surfaces (9, 21). The semiconductor die element (3) and cap element (23) are configured such that when the semiconductor die element (3) and cap element (4) are conjoined, a first volume (7, 27) is formed through the semiconductor die element (3) and into the semiconductor cap element (23), and an acoustic channel is formed to provide an opening between a non-mating surface (11) of the semiconductor die element (3) and either a side surface (10, 12) of the transducer package or a non-mating surface (29) of the cap element (23).
A MEMS transducer package comprising:
A MEMS transducer package as claimed in 8, further comprising a cap portion comprising a thickness bounded by a first surface and an opposite second surface, wherein the second surface of the cap portion abuts the first surface of the semiconductor die portion.
A semiconductor die portion for use in a MEMS transducer package, the semiconductor die portion comprising:
A MEMS transducer package comprising:
Dependencies are inferred from the claim text.