Wafer-level methods for packing camera modules, and associated camera modules

A wafer-level method for packaging a plurality of camera modules, comprising:

• overmolding a first housing material around a plurality of image sensors to produce a first wafer of packaged image sensors, the plurality of image sensors being supported in the first wafer exclusively by the first housing material, said overmolding a first housing material including molding the first housing material only to sides of the image sensors facing away from the optical axis of each of the image sensors and not to sides of the image sensors facing along the optical axis, such that the first wafer supports the image sensors through pressure of the first housing material on the sides after cooling-associated shrinkage of the first housing material;
• seating a plurality of lens units on the first housing material above the plurality of image sensors, respectively;
• and
• after the step of seating, overmolding a second housing material over the first wafer and around the lens units to form a second wafer of packaged camera modules each including one of the image sensors and one of the lens units, the second housing material cooperating with the first housing material to secure the lens units in the second wafer.