Microelectronic package communication using radio interfaces connected through waveguides

A computing device comprising:

• a system board;
• a central processing unit (CPU);
• a package substrate mounted to the system board to carry the CPU, the package substrate having conductive connectors to connect the CPU to external components;
• a radio die on the package substrate and coupled to the CPU through the package substrate, the radio die to modulate data onto a carrier and to transmit the modulated data;
• a waveguide connector coupled to a dielectric waveguide to receive the transmitted modulated data from the radio die and to couple it into the dielectric waveguide, the dielectric waveguide to carry the modulated data to an external component;
• and
• a chipset carried by the system board coupled through the system board to the integrated circuit chip through the package substrate;
• wherein the system board comprises a plurality of additional radio dies, the apparatus computing device further comprising a dielectric substrate having a series of antennas each having a wiring element to connect to a respective radio die, each radio die being coupled to a respective dielectric waveguide.

An apparatus comprising:

• a system board;
• an integrated circuit chip package mounted to the system board having an integrated circuit chip, a radio die and conductive connectors to connect the integrated circuit chip to the radio die through the package substrate, the radio die to modulate data from the integrated circuit chip onto a carrier and to transmit the modulated data away from the package substrate, the radio die further to receive modulated data, to demodulate the received data and transmit the demodulated data to the integrated circuit chip;
• a first waveguide connector on the system board to receive the transmitted modulated data from the] radio die and to couple the received modulated data into a waveguide;
• and
• a second waveguide connector coupled to the waveguide to connect the received modulated data in the waveguide to a remote device;
• wherein the first waveguide connector comprises a substrate attached to the system board, a metal plate antenna attached to the substrate, a waveguide transition formed in the substrate coupled to the metal plate antenna, and a dielectric waveguide attached to the substrate and coupled to the waveguide transition.