Device and method for processing substrates

A device for treating substrates comprising:

• first and second processing cylinders defining a processing nip between which substrates being treated can pass, the substrates passing through the processing nip defined by the first and second processing cylinders being processed by tool parts carried by at least one of the first and second processing cylinders, the tool parts including at least one of cutting tools, punching tools, creasing tools, perforating tools and grooving tools;
• a separation system located after, in a direction of substrate travel through the device for treating substrates, the first and second processing cylinders, the separating device separating each substrate, treated by the first and second processing cylinders, into at least one blank substrate section and at least one waste substrate section;
• a transport cylinder in the separation system and having a plurality of first air openings;
• a detachably secured transport cylinder packing on a circumferential surface of the transport cylinder, the detachably secured transport cylinder packing having a plurality of transport cylinder packing perforations and transport cylinder packing depressions, at least one of the transport cylinder packing perforations covering one of the plurality of transport cylinder packing first air openings, the transport cylinder packing depressions including ones of the perforations;
• a stripping cylinder in the separation system and cooperating with the transport cylinder;
• and
• a detachably secured stripping cylinder packing on the stripping cylinder, the stripping cylinder packing having a plurality of raised regions, which raised regions are receivable in the depressions in the transport cylinder packing.