Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder
AssigneeIowa State University Research Foundation, Inc.
InventorsIver E. Anderson, Joel L. Harringa, Adam J. Boesenberg
Life of this patent
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Abstract
A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag3Sn blades.
Claims3
A solder alloy that is solidified on an electrically conductive substrate comprising copper, said solder alloy consisting essentially of 0.95 to about 3.5 weight % Cu, from 0.15 to about 0.25 weight % Al, and balance consisting essentially of Sn, wherein the Al promotes nucleation of pro-eutectic Cu6Sn5 within the solder alloy which pro-eutectic Cu6Sn5 provides additional interface area for Sn nucleation, said solder alloy providing reduced undercooling that is less an 8 degrees C. upon solder solidification on the electrically conductive substrate as compared to a solder alloy free of Al.
A solder alloy that is solidified on an electrically conductive substrate comprising copper, said solder alloy consisting essentially of about 0.95 to about 3.05 weight % Cu, 0.15 to about 0.25 weight Al, and balance consisting essentially of Sn, wherein the Al promotes nucleation of pro-eutectic Cu6Sn5 within the solder alloy which nucleation, said solder alloy providing reduced undercooling that is less then 8 degrees C. upon solder solidification on the electrically conductive substrate as compared to a solder alloy free of Al.
A solder alloy consisting essentially of 0.95 to about 3.5 weight % Cu, from 0.20 to about 0.25 weight % Al, and balance consisting essentially of Sn, said solder alloy providing reduced undercooling upon solder solidification on an electrically conductive substrate comprising copper as compared to the solder alloy free of Al, wherein said reduced undercooling is less than 8 degrees C. upon solder solidification.
Dependencies are inferred from the claim text.