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US 10,442,032 B2Granted
Processing device and processing method
AssigneeMitsubishi Heavy Industries, Ltd.
InventorsSaneyuki Goya, Kenji Muta, Toshiya Watanabe, Takashi Ishide
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AssigneeMitsubishi Heavy Industries, Ltd.
InventorsSaneyuki Goya, Kenji Muta, Toshiya Watanabe, Takashi Ishide
Estimating the term…
Provided are a processing device and a processing method with which the device can be made more compact, and with which highly precise processing can be performed. The processing device, which processes a member to be processed by irradiating the member to be processed with a laser, has: a laser oscillator having a plurality of vertical cavity surface-emitting laser diode chips that output laser light having a wavelength of 1,070 nm or less, and a substrate on the surface of which the plurality of vertical cavity surface-emitting laser diode chips are arranged in a matrix; a guidance optical system that guides the laser light output from the laser oscillator; and a control device that controls the output of the laser oscillator.
A processing device that processes a member to be processed by irradiating the member to be processed with a laser, the device comprising:
A processing device that processes a member to be processed, the device comprising:
A processing method for processing a member to be processed by irradiating the member to be processed with a laser, the method comprising:
A processing method for processing a member to be processed by irradiating the member to be processed with a laser, the method comprising:
Dependencies are inferred from the claim text.