Disinfectant material comprising a copper halide salt and surfactant

An anti-microbial material disinfectant solution comprising:

• (a) nanoparticles including copper and a halogen, the particles being operable to produce copper ions,
• wherein the copper ions are in a form of cuprous ions,
• wherein the cuprous ions transform into cupric ions in the presence of a microbial,
• wherein the transformation of cuprous ions to cupric ions occurs by a Fenton-type reaction,
• wherein the cupric ions reverse back catalytically to cuprous ions in the presence of the halogen;
• and
• (b) a polar solvent comprising alcohol or water forming a solution, wherein the copper composition has a concentration of 5 to 500 mg of the copper composition per liter of the solution;
• and
• (c) a surfactant operable to facilitate cohesion of the material to a surface, the surfactant provided in the solution at a concentration of 0.1% to 0.5% and operable to form a complex that traps the solution in the immediate surrounding volume of the particles;
• (d) polyphenylsilsequioxane at a concentration of 0.1 to 50% of the solution by volume:
• wherein the disinfectant solution is operable to form a nanofilm layer on positively and negatively charged surfaces.

An anti-microbial material comprising,

• an anti-microbial copper composition, including particles that are able to produce copper ions,
• wherein the copper ions are in a form of cuprous ions,
• wherein the cuprous ions may be transformed into cupric ions,
• wherein the transformation of cuprous ions to cupric ions occurs by a Fenton-type reaction,
• wherein the cupric ions may reverse back catalytically to cuprous ions
• and an alcohol based solution,
• wherein the solution comprises 3-methoxy-3-methyl-1-butanol in an amount between 80% and 99.9% of the solution by weight,
• wherein the copper composition has limited solubility in the solution,
• wherein the limited solubility is below 50 mg of the copper composition per liter of the solution.

An anti-microbial material disinfectant solution comprising:

• (a) copper iodide salt particles operable to produce copper ions,
• wherein the copper ions are in a form of cuprous ions, wherein the cuprous ions transform into cupric ions,
• wherein the transformation of cuprous ions to cupric ions occurs by a Fenton-type reaction,
• and wherein the cupric ions reverse back catalytically to cuprous ions;
• (b) a water or alcohol based solution, wherein the copper iodide salt has a concentration of 5 to 500 mg of the copper iodide salt per liter of the solution;
• (c) at least one surfactant operable to facilitate cohesion of the material to a surface, wherein the surfactant is provided in the solution at a concentration of 0.1% to 0.5%;
• and
• (d) at least one member selected from the group consisting of a pH stabilizer;
• a preservative, a rheology agent, chelating agent, a humectant, and combinations thereof;
• (e) polyphenylsilsequioxane at a concentration of 0.1 to 50% of the solution by volume;
• wherein the material is operable to form a nanofilm layer on positively and negatively charged surfaces.

A method of disinfecting a surface, the method comprising:

• (a) providing an anti-microbial disinfectant solution having a water or alcohol based comprising:
• (i) copper halide salt particles that produce copper ions in a form of cuprous ions, the copper halide salt particles having a concentration of 5 to 500 mg per liter of the solution;
• (ii) an anionic surfactant with an alkyl non-polar tail configured to facilitate cohesion of the material to a surface provided in the solution at a concentration of 0.1% to 0.5%;
• and
• (iii) a polar solvent, wherein the polar solvent, anionic surfactant, and copper iodide salt particles come together to form a complex that traps the polar solvent in the immediate surrounding volume of the copper iodide salt particles;
• and
• (iv) polyphenylsilsequioxane at a concentration of 0.1 to 50% of the solution by volume;
• (b) applying the antimicrobial disinfectant solution to the surface;
• (c) forming a nanolayer of the disinfectant solution on the surface;
• (d) exposing the surface to a microbial;
• (e) transforming the cuprous ions into cupric ions in the presence of the microbial, wherein the transformation of cuprous ions to cupric ions occurs by a Fenton-type reaction;
• and
• (f) catalytically reversing back the cupric ions to cuprous ions in the presence of the halide.