Heat dissipation structure of electronic device
AssigneesFu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
InventorCheng-Xiang Liu
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Abstract
A heat dissipation structure of an electronic device includes a casing, an upper motherboard located within the casing, a lower motherboard located within the casing and space apart from the upper motherboard, and a heat dissipation device located between the upper motherboard and the lower motherboard. The heat dissipation device extends out from between the upper motherboard and the lower motherboard to contact the casing. Between the upper motherboard and the lower motherboard is located a plurality of heat generating components directly in contact with the heat dissipation device, so that heat generated by the heat generating components is dissipated to the casing.
Claims10
A heat dissipation structure of an electronic device having a casing, the heat dissipation structure comprising:
- an upper motherboard located within the casing,
- a lower motherboard located within the casing and spaced apart from the upper motherboard, and
- a heat dissipation device located between the upper motherboard and the lower motherboard and extending out from between the upper motherboard and the lower motherboard to contact the casing;
- wherein a plurality of heat generating components are located between the upper motherboard and the lower motherboard, and directly in contact with the heat dissipation device, so that heat generated by the heat generating components is dissipated to the casing.
Dependencies are inferred from the claim text.