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US 10,381,256 B2Granted
Apparatus and method for chucking warped wafers
AssigneeKLA-Tencor Corporation
InventorsPradeep Subrahmanyan, Luping Huang, Chris Pohlhammer
Life of this patent
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Abstract
An apparatus for fixing a wafer, including a chuck having a surface, a plurality of through bores in the chuck extending through the surface of the chuck, a fixed vacuum bellows, and a plurality of floating air bearings, wherein the fixed vacuum bellows and a respective floating air bearing of the plurality of floating air bearings are each individually arranged in separate through bores of the plurality of through bores and elevationally above the surface of the chuck.
Claims10
An apparatus for fixing a wafer, comprising:
- a chuck comprising a surface;
- a plurality of through bores in the chuck extending through the surface of the chuck;
- a fixed vacuum bellows;
- and,
- a plurality of floating air bearings, wherein the fixed vacuum bellows and a respective floating air bearing of the plurality of floating air bearings are each individually arranged in separate through bores of the plurality of through bores, each is configured for reciprocating movement within a respective through bore, and each includes a pad surface disposable from a position that is flush with the surface of the chuck and to a position that is above the surface of the chuck.
2 more elements
An apparatus for fixing a wafer, comprising:
- a chuck comprising a surface;
- a plurality of through bores in the chuck extending through the surface of the chuck;
- at least two location pins each arranged proximate an edge of the surface of the chuck and extending above the surface of the chuck in a direction substantially orthogonal to the surface of the chuck;
- a first floating air bearing arranged within a first through bore of the plurality of through bores;
- a second floating air bearing arranged within a second through bore of the plurality of through bores;
- and,
- a fixed vacuum bellows arranged within a third through bore of the plurality of through bores, wherein
- one or more of the first floating air bearing, the second floating air bearing, and fixed vacuum bellows include a pad surface configured for reciprocating movement between a position that is flush with the surface of the chuck and to a position that is above the surface of the chuck.
5 more elements
Dependencies are inferred from the claim text.