Mechanically attached edge shield
AssigneeMicrosoft Technology Licensing, LLC
InventorsMark Mitchell Gloster, Whitney Giaimo, John Godfrey
Life of this patent
Estimating the term…
Abstract
The edge shields disclosed herein utilize a plated edge surface of a PCB to form one or more sides of an electronic shield to reduce the amount of top surface area of the PCB occupied by the electronic shield. More specifically, an edge shield lid is mechanically attached to the plated edge surface to remove a need for solder overprint at the edge of the PCB. The edge shield lid is soldered, welded, adhered, or mechanically attached to edge walls where there is no available edge surface for attachment.
Claims20
A printed circuit board comprising:
- a substrate with a plated edge surface, the substrate including a top surface and a bottom surface, the plated edge surface extending between the top surface and the bottom surface;
- a shield wall placed on the substrate, wherein a combination of the plated edge surface and the shield wall form a continuous conductive loop;
- and
- a shield lid mechanically engaged and in conductive contact with the plated edge surface and in conductive contact with the shield wall.
A method of assembling a printed circuit board comprising:
- plating at least one edge surface of a substrate, the edge surface extending between a top surface of the substrate and a bottom surface of the substrate;
- placing a shield wall onto the substrate, wherein a combination of the plated edge surface and the shield wall form a continuous conductive loop;
- and
- securing a shield lid onto the substrate mechanically engaged and in conductive contact with the plated edge surface and in conductive contact with the shield wall.
A printed circuit board comprising:
- a substrate with a plated edge surface, the substrate including a top surface and a bottom surface, the plated edge surface extending between the top surface and the bottom surface;
- a shielded electronic component placed on the substrate;
- a shield wall placed on the substrate, wherein a combination of the plated edge surface and the shield wall form a continuous conductive loop about the shielded electronic component;
- and
- a shield lid mechanically engaged and in conductive contact with the plated edge surface, the shield lid further attached to and in conductive contact with the shield wall, wherein the substrate, the shield wall, and the shield lid in combination envelop the shielded electronic component.
Dependencies are inferred from the claim text.