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US 10,375,849 B2Granted
Backplane electronic board and associated electronic control unit
AssigneeSafran Electronics & Defense
InventorsFrancois Guillot, Pascal Spoor, Patrice Chetanneau
Life of this patent
Estimating the term…
Abstract
The present invention concerns a backplane electronic board (20) having on inner face (142) suitable for being connected to electronic board connectors (12) and an outer face (143) suitable for being connected to an outer connector (15), the backplane board (20) being characterized in that it has blind holes opening on the inner face (142) of same, and holes opening on the outer face (143) of same, the holes being suitable for receiving press-fit connection elements and forming therewith an electrical connection point.
Claims10
A backplane electronic board comprising:
- an internal face adapted for being connected to connectors of electronic boards and an external face adapted for being connected to an external connector, the backplane board having a first leak-proof membrane, a series of first blind holes opening on the one hand on the internal face of the backplane electronic board and on the other hand on the first leak-proof membrane, and a second leak-proof membrane, a series of second blind holes opening on the one hand on the external face of the backplane electronic board and on the other hand on the second leak-proof membrane, the first and the second blind holes being adapted for receiving force-insertion connection elements and forming with them an electric connection point;
- two conductive layers connected to two equipotentials positioned on either side of a central insulating layer, both conductive layers being connected together with a cylindrical metal layer, and further having metallized through-holes which cross the backplane board on both sides, the metallized through-holes, the cylindrical metal layer, and both conductive layers forming a capacitive through-hole and therefore a low-pass filtering network ensuring a function of filtering the electromagnetic noise;
- a main printed circuit having two multilayer printed circuits, two insulating layers, and a double face printed circuit positioned between the two insulating layers, the two insulating layers positioned between the two multilayer printed circuits, the double face printed circuit forming a shielding area;
- and
- an interface platelet attached on the main printed circuit, the interface platelet having holes adapted for receiving force-insertion connection elements and forming with them an electric connection point.
2 more elements
A backplane electronic board comprising:
- an internal face adapted for being connected to connectors of electronic boards and an external face adapted for being connected to an external connector, the backplane board having a first leak-proof membrane, a series of first blind holes opening on the one hand on the internal face of the backplane electronic board and on the other hand on the first leak-proof membrane, and a second leak-proof membrane, a series of second blind holes opening on the one hand on the external face of the backplane electronic board and on the other hand on the second leak-proof membrane, the first and the second blind holes being adapted for receiving force-insertion connection elements and forming with them an electric connection point;
- two conductive layers connected to two equipotentials positioned on either side of a central insulating layer, both conductive layers being connected together with a cylindrical metal layer, and further having metallized through-holes which cross the backplane board on both sides, the metallized through-holes, the cylindrical metal layer, and both conductive layers forming a capacitive through-hole and therefore a low-pass filtering network ensuring a function of filtering the electromagnetic noise;
- a main printed circuit having two multilayer printed circuits, two insulating layers, and a double face printed circuit positioned between the two insulating layers, the two insulating layers positioned between the two multilayer printed circuits, the double face printed circuit forming a shielding area;
- the backplane electronic board further comprising:
- a first printed circuit having a face intended to form the internal face of the backplane electronic board;
- a second printed circuit having a face intended to form the external face of the backplane electronic board and;
- a third printed circuit;
- the first leak-proof membrane being positioned between the first printed circuit and the third printed circuit;
- the second leak-proof membrane being positioned between the second printed circuit and the third printed circuit;
- wherein the first membrane is positioned between the multilayer printed circuit, and one of the insulating layers;
- and
- an interface platelet attached on the main printed circuit, the interface platelet having holes adapted for receiving force-insertion connection elements and forming with them an electric connection point.
9 more elements
Dependencies are inferred from the claim text.