Sleeved coaxial printed circuit board vias

A method of manufacturing a sleeved coaxial via in a printed circuit board, comprising:

• affixing a plurality of layers together, one on top of another, to form the printed circuit board;
• drilling a first hole through said plurality of layers;
• plating an inner circumference of said first hole with a conductive material to create a metal sleeve;
• depositing an insulating material in said first hole after said plating, wherein said insulating material fills the first hole and is disposed at a top surface and a bottom surface of said printed circuit board;
• plating an entirety of said top surface, an entirety of said bottom surface and said insulating material disposed at said top surface and said bottom surface;
• drilling a second hole through said insulating material after said insulating material has been plated;
• inserting a conductive material in said second hole to form a conductive path;
• electrically connecting the metal sleeve to ground;
• and
• electrically connecting a signal trace on an outer layer of said printed circuit board to said conductive path, wherein the outer layer comprises said top surface or said bottom surface.