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US 10,375,834 B1Granted
3D printing with components embedded
AssigneeFlextronics AP, LLC
InventorsWeifeng Liu, Murad Kurwa
Life of this patent
Estimating the term…
Abstract
Methods of and devices for using additive processes (e.g., 3D printing) to embed components inside an object are disclosed. In some embodiments, the components include active components, such as computer chips. In other embodiments, the components include passive components, such as inductor, resistor, and capacitors. The methods and devices disclosed herein can be used for rapid prototyping and fast manufacturing.
Claims10
A method of making an electronic board comprising:
- a. coupling one or more discrete electronic components to a base layer;
- and
- b. additive printing around and on the one or more electronic components after coupling the one or more electronic components to the base layer, wherein additive printing forms an insulating layer over the one or more electronic components, wherein the insulating layer has one or more holes formed by the additive process, the one or more holes extending through the insulating layer to a surface of each electronic component.
Dependencies are inferred from the claim text.