Method of forming an interference shield on a substrate

A method of forming an interference shield on a substrate, the method comprising:

• providing a die comprising contact points;
• forming a build-up carrier adjacent a device side of the die, the build-up carrier comprising a plurality of alternating layers of patterned conductive material and insulating material, wherein at least one of the layers of patterned conductive material is coupled to one of the contact points of the die, wherein forming the build-up carrier comprises forming the plurality of alternating layers of conductive material and dielectric material on a sacrificial panel and after forming the plurality of alternating layers of conductive material and dielectric material, separating the build-up carrier from the sacrificial panel;
• and
• forming an interference shield on a portion of the build-up carrier, wherein the interference shield is formed on a surface of the build-up carrier adjacent a backside of the die, wherein forming the interference shield comprises sputtering a target material, and wherein the plurality of different conductive materials comprise copper and nickel.