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US 10,375,825 B2Granted
Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
AssigneeMitsubishi Materials Corporation
InventorsNobuyuki Terasaki, Yoshiyuki Nagatomo, Kimihito Nishikawa, Yoshirou Kuromitsu
Life of this patent
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Abstract
This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate 11; a nitride layer 31 that is formed on the surface of the ceramic substrate 11 between the copper plate and the ceramic substrate 11; and an Ag—Cu eutectic structure layer 32 having a thickness of 15 μm or less that is formed between the nitride layer and the copper plate.
Claims7
A power module substrate, comprising:
- a ceramic substrate that is formed of AlN or Si3N4 and has a first surface;
- a copper plate that is formed of copper or a copper alloy and is laminated and bonded on the first surface of the ceramic substrate;
- a nitride layer that contains at least one nitride of elements selected from Ti, Hf, Zr, and Nb, is formed on the first surface of the ceramic substrate between the copper plate and the ceramic substrate and the nitride layer contains one or two or more additional elements selected from In, Al, Mn and Zn;
- and
- an Ag—Cu eutectic structure layer that has a thickness of 15 μm or less and is formed between the nitride layer and the copper plate,
- wherein
- the thickness of the Ag—Cu eutectic structure layer is measured by a method comprising:
- obtaining a backscattered electron image of an interface between the copper plate and the ceramic substrate using an EPMA;
- based on the backscattered electron image, measuring the area of the Ag—Cu eutectic structure layer continuously formed on the bonding interface in a measurement visual field at a magnification of 2000 times;
- dividing the area of the Ag—Cu eutectic structure layer by the width of the measurement visual field, and
- obtaining the average of the thicknesses in five measurement visual fields as the thickness of the Ag—Cu eutectic structure layer.
8 more elements
A power module substrate, comprising:
- a ceramic substrate that is formed of AlN or Si3N4 and has a first surface;
- a copper plate that is formed of copper or a copper alloy and is laminated and bonded on the first surface of the ceramic substrate;
- a nitride layer that contains a nitride of Nb and is formed on the first surface of the ceramic substrate between the copper plate and the ceramic substrate;
- and
- an Ag—Cu eutectic structure layer that has a thickness of 15 μm or less and is formed between the nitride layer and the copper plate,
- wherein
- the thickness of the Ag—Cu eutectic structure layer is measured by a method comprising:
- obtaining a backscattered electron image of an interface between the copper plate and the ceramic substrate using an EPMA;
- based on the backscattered electron image, measuring the area of the Ag—Cu eutectic structure layer continuously formed on the bonding interface in a measurement visual field at a magnification of 2000 times;
- dividing the area of the Ag—Cu eutectic structure layer by the width of the measurement visual field, and
- obtaining the average of the thicknesses in five measurement visual fields as the thickness of the Ag—Cu eutectic structure layer.
8 more elements
Dependencies are inferred from the claim text.