Multi-functional high-current circuit board

A multifunctional high current circuit board comprising:

• a. a high-current-conducting layer that includes a high current-carrying structure:
• and b. a switching layer that includes:
• two switching sub-layers electrically and thermally connected to the high current-carrying structure, and at least two heat sources arranged adjacent to one another, disposed below the two switching sub-layers, wherein the two switching sub-layers are configured to carry high current potentials;
• wherein the two switching sub-layers are interconnected by at least one micro through-hole plating;
• wherein high current-carrying potentials are conducted into the switching layer;
• and a monolithic passive cooling element configured to overlay the at least two heat sources, wherein the passive cooling element defines first and second partially enclosed spaces for receiving a first and a second of the at least two heat sources, respectively, wherein an interior of the first enclosed space is configured to compliment an outside surface of the first heat source, and an interior of the second enclosed space is configured to complement an outside surface of the second heat source to thereby efficiently draw heat generated by the respective heat sources away from the heat sources.