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US 10,375,823 B2Granted
Differential signal traces including a solder mask disposed thereon
AssigneeFci USA LLC
InventorBenjamin Reed Staudt
Life of this patent
Estimating the term…
Abstract
Disclosed herein is a method. A first electrically conductive trace is provided on a substrate. A second electrically conductive trace is providing on the substrate proximate the first electrically conductive trace. A solder mask is provided at the first and the second electrically conductive traces. A portion of the first electrically conductive trace is free of any portion of the solder mask covering thereon.
Claims26
A method comprising:
- providing a first electrically conductive trace on a substrate;
- providing a second electrically conductive trace on the substrate proximate the first electrically conductive trace;
- and
- providing a solder mask at the first and the second electrically conductive traces, wherein a portion of the first electrically conductive trace is free of any portion of the solder mask covering thereon and wherein:
- the providing of the solder mask further comprises covering the first and the second electrically conductive traces including the portion of the first electrically conductive trace and subsequently removing the solder mask from the portion of the first electrically conductive trace.
2 more elements
A printed circuit board comprising:
- a substrate;
- a first electrically conductive trace on the substrate;
- a second electrically conductive trace on the substrate proximate the first electrically conductive trace;
- and
- a solder mask at the first and the second electrically conductive traces, wherein the solder mask covers a length of the second electrically conductive trace, and wherein the solder mask does not cover an adjacent length of the first electrically conductive trace, and wherein the solder mask covers a majority of the first and the second electrically conductive traces.
2 more elements
A method comprising:
- providing a first electrically conductive trace on a substrate;
- providing a second electrically conductive trace on the substrate proximate the first electrically conductive trace;
- and
- providing a solder mask at the first and the second electrically conductive traces, wherein a portion of the first electrically conductive trace is free of any portion of the solder mask covering thereon and wherein:
- the providing of the solder mask further comprises temporarily masking the portion of the first electrically conductive trace when the solder mask is applied over the substrate.
2 more elements
Dependencies are inferred from the claim text.