US 10,375,822 B2Granted

Circuit board with return path separated low crosstalk via transition structure

AssigneeAdvanced Micro Devices, Inc.

InventorsYuan Li, James R. Foppiano, Jonathan P. Dowling, Gerald J. Merits, Manjunath Shivappa, Wasim I. Ullah, Claude Hilbert

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Abstract

Various circuit boards and systems are disclosed. In one aspect a system includes a circuit board and n differential signal via pairs. Each of the n differential signal via pairs has a first signal via and a second signal via and an electrical wall between the first signal via and the second signal via. There is a midline between every two adjacent differential via pairs. There are n ground return path vias. Each of the n ground return path vias is positioned substantially along one of the midlines and not on one of the electrical walls.

Claims20

Dependent claims

A circuit board, comprising:

a first differential signal via pair having a first signal via and a second signal via and a first electrical wall between the first signal via and the second signal via;
a second differential via pair having a third signal via and a fourth signal via and a second electrical wall between the third signal via and the fourth signal via, there being a first midline between the first differential signal via pair and the second differential signal via pair;
a third differential signal via pair having a fifth signal via and a sixth signal via and a third electrical wall between the fifth signal via and the sixth signal via, there being a second midline between the third differential signal via pair and the second differential signal via pair;
a first ground return path via positioned substantially along the first midline and not on the first electrical wall or the second electrical wall and a second ground return path via is positioned substantially along the second midline and not on the second electrical wall or the third electrical wall.

1 more element

Dependencies are inferred from the claim text.

Facts

Application: 15/379,994Filed 15 Dec 2016
Published: US 2018/0177043 A121 Jun 2018
Granted: 6 Aug 2019
Term ends: Not estimatedThe source records don’t support an estimate.

Classification8 codes

H05K 1/0245
High frequency adaptations: lay-out of balanced signal pairs, e.g. differential lines or twisted lines
H01P 3/081
Microstrips; Strip lines: microstriplines
H05K 1/0251
Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance: related to vias or transitions between vias and transmission lines
H05K 1/0298
Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295: multilayer circuits

Family

US 2018/0177043 A1Pre-grant publication · published 21 Jun 2018
US 10,375,822 B2This patent

From the US filing history. Foreign family members aren’t listed.

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