Printed-circuit board, printed-wiring board, and electronic apparatus
AssigneeCanon Kabushiki Kaisha
InventorKeita Yamazaki
Life of this patent
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AssigneeCanon Kabushiki Kaisha
InventorKeita Yamazaki
Estimating the term…
A printed-wiring board has a land group with which a terminal group of a semiconductor package has been joined, a first conductor pattern arranged in a mounting area where the semiconductor package is mounted and joined with a heat radiation plate of the semiconductor package, a second conductor pattern, at least a part of which is arranged on the outside of the mounting area, and a third conductor pattern which connects the first and second conductor patterns. The land group includes a first land adjacent to the third conductor pattern and a second land which is not adjacent to the third conductor pattern, and the first land is formed in a shape different from that of the second land so as to be away from the third conductor pattern.
A printed-circuit board comprising:
A printed-wiring board on which an electronic component having a heat radiation part can be mounted, comprising:
An electronic device comprising:
Dependencies are inferred from the claim text.