Imaging device with improved heat dissipation including a board section between a first and a second housing

An imaging device comprising:

• a board section on which an imaging element is loaded, the board section including a first through hole and a conductor body pattern formed on an edge surface of a top side of the board section;
• a first housing section for fixing the board section from a surface on which the imaging element is loaded, the first housing section including a screw hole;
• a second housing section for fixing the board section from a surface opposite to the surface on which the imaging element is loaded, the second housing section including a second through hole;
• a lens section attached to the first housing section;
• and
• an attachment member that extends through the second through hole, extends through the first through hole, and screws into the screw hole to fix the first housing section and the second housing section so as to sandwich the board section,
• wherein the conductor body pattern is connected to a ground potential of the board section, and one of the first housing section and the second housing section contact the conductor body pattern when fixed to the board section,
• wherein the conductor body pattern is a first conductor body pattern and the board section includes a second conductor body pattern on an edge surface of a bottom side of the board section that is opposite to the top side,
• wherein the first conductor body pattern contacts the first housing section when fixed to the board section and the second conductor body pattern contacts the second housing section when fixed to the board section,
• wherein the first conductor body pattern and the second conductor body pattern are each formed in the board section and covered by a protective layer at portions other than the edge surface of the top side and the bottom side of the board section, respectively,
• wherein the board section includes a control board formed from a glass-epoxy board and the protective layer is formed by a resist on a top side and on a bottom side of the control board, and
• wherein the first conductor body pattern and the second conductor body pattern are formed by copper wiring in the glass-epoxy board exposed by removal of the protective layer.