Rack level pre-installed interconnect for enabling cableless server/storage/networking deployment

An apparatus comprising:

• a first chassis, configured to be installed in a first slot in a rack, including a first component contained therein having a first extremely high frequency (EHF) transceiver chip electrically coupled thereto;
• a second chassis, configured to be installed in a second slot in the rack, including a second component contained therein having a second EHF transceiver chip electrically coupled thereto;
• and
• a first plastic waveguide, operatively coupled to at least one of the first chassis, the second chassis, and the rack, having a first end proximate to the first EHF transceiver chip and a second end proximate to the second EHF transceiver chip, wherein the first plastic waveguide is configured to facilitate a bi-directional millimeter-wave communication link between the first and second EFH transceiver chips when the first and second components are operating, and wherein the first plastic waveguide is not mechanically coupled to any of the first component, the second component, the first EHF transceiver chip and the second EHF transceiver chip.

An apparatus, comprising:

• a chassis frame including a metal top plate in which a plurality of holes are formed;
• a backplane, mounted to the chassis frame proximate to the metal top plate, having a plurality of extremely high frequency (EHF) transceiver chips mounted thereto, wherein the plurality of EHF transceiver chips are aligned with the plurality of holes formed in the metal top plate;
• and
• at least one plastic waveguide having a plurality of legs, each leg disposed proximate to a respective EHF transceiver chip,
• wherein upon operation of the apparatus, millimeter-wave radio frequency (RF) signals transmitted from each EHF transceiver chip is coupled into the at least one plastic waveguide via the leg that is disposed proximate to the EHF transceiver chip.

An apparatus comprising:

• a rack, having a plurality of chassis slots configured to have removable chassis installed therein, including first and second chassis slots;
• a plurality of pre-installed plastic waveguides, coupled to the rack, having a first set of means for coupling millimeter-wave radio frequency (RF) signals arranged in a first pattern, and a second set of means for coupling millimeter-wave RF signals arranged in a second pattern,
• wherein the first set of means for coupling millimeter-wave RF signals are arranged such that when a first chassis having a first set of extremely high frequency (EHF) transceiver chips arranged in the first pattern is installed in the first chassis slot, a means for coupling millimeter-wave RF signals in the first set of means for coupling millimeter-wave RF signals is disposed proximate to a respective EHF transceiver chip in the first set of EHF transceiver chips;
• wherein the second set of means for coupling millimeter-wave RF signals are arranged such that when a second chassis having a second set of extremely high frequency (EHF) transceiver chips arranged in the second pattern is installed in the second chassis slot, a means for coupling millimeter-wave RF signals in the second set of means for coupling millimeter-wave RF signals is disposed proximate to a respective EHF transceiver chip in the second set of EHF transceiver chips;
• and
• wherein the plurality of pre-installed plastic waveguides are configured to facilitate a bi-directional millimeter-wave communication links between EHF transceiver chips in the first set of EHF transceiver chips and EHF transceiver chips in the second set of EHF transceiver chips when the first and second set of EHF transceiver chips are operating.