Electronic device and drive device including the same

An electronic device, comprising:

• a substrate;
• an electronic component which is mounted on the substrate and includes a chip, an electrical conductor electrically connected to the chip, and an insulator portion that molds the chip with the electrical conductor;
• an insulating and heat dissipating material disposed on a side of the electronic component opposite from the substrate;
• and
• a heat sink that includes a first surface, a second surface and a support portion, the support portion being formed away from the first surface and the second surface, and a distal end portion of the support portion being fixed to the substrate to space the electronic component away from the first surface and the second surface,
• wherein
• the heat sink is configured to absorb heat which is generated from the electronic component,
• the first surface faces the electrical conductor, which is exposed at the side of the electronic component opposite from the substrate, such that the insulating and heat dissipating material is interposed between the first surface and the electrical conductor,
• the second surface is positioned closer toward the substrate than the first surface is,
• the second surface is positioned directly below the insulator portion to face the insulator portion and is spaced away from the insulator portion by a particular spacing,
• the heat dissipating material is further interposed between the insulator portion and the second surface, and
• the second surface is configured to be abuttable with the insulator portion.

An electronic device, comprising:

• a substrate;
• an electronic component which is mounted on the substrate and includes a chip, an electrical conductor electrically connected to the chip, and an insulator portion that molds the chip with the electrical conductor;
• an insulating and heat dissipating material disposed on a side of the electronic component opposite from the substrate;
• and
• a heat sink that includes a first surface, a second surface and a support portion, the support portion being formed away from the first surface and the second surface, and a distal end portion of the support portion being fixed to the substrate to space the electronic component away from the first surface and the second surface,
• wherein
• the heat sink is configured to absorb heat which is generated from the electronic component,
• the first surface faces the electrical conductor, which is exposed at the side of the electronic component opposite from the substrate, such that the insulating and heat dissipating material is interposed between the first surface and the electrical conductor,
• the second surface is positioned closer toward the substrate than the first surface is,
• the second surface is positioned to overlap with the insulator portion when viewed along a direction orthogonal to the second surface so as to face the insulator portion and is spaced away from the insulator portion by a particular spacing, and
• no portion of the second surface overlaps with the electronic conductor when viewed along the direction orthogonal to the second surface.