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US 10,374,419 B2Granted
Distributed electrostatic discharge protection for an on-package input/output architecture
AssigneeIntel Corporation
InventorsTodd W. Mellinger, Michael E. Griffith, Ganesh Balamurugan, Thomas P. Thomas
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Abstract
An on-package interface. A first set of single-ended transmitter circuits on a first die. A first set of single-ended receiver circuits on a second die. The receiver circuits have a termination circuit comprising an inverter and a resistive feedback element. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines are matched.
Claims9
An apparatus, comprising:
- circuitry on a semiconductor chip to drive a signal externally from said semiconductor chip, said circuitry comprising:
- a) a first driver slice having a first series resistance coupled to an output pad of the semiconductor chip;
- b) a second driver slice having a second series resistance coupled to the output pad, the second series resistance having a different designed-for resistance than said first series resistance;
- c) electrostatic discharge (ESD) protection diodes directly coupled to the output pad.
1 more element
Dependencies are inferred from the claim text.