Feeder-cover structure and semiconductor production apparatus

A semiconductor production apparatus, comprising:

• a mount table;
• an electrostatic chuck disposed on the mount table;
• a heater provided in the electrostatic chuck;
• a feeder-cover structure;
• and
• a power source that supplies an electric current to the heater, wherein
• the feeder-cover structure includes
• a power feeder that connects the power source to the electrostatic chuck and includes a socket and a plug that are fitted together and electrically connected to each other,
• a cover structure that covers and seals the power feeder, and
• a supply mechanism that supplies one of dry air and an inert gas into the cover structure;
• the cover structure includes a first cover structure for covering the plug and a second cover structure for covering the socket, the first cover structure also housing the second cover structure;
• a gap is formed between the socket and the second cover structure to surround an entire circumference of the socket, the gap forming a part of a flow path and allowing the one of the dry air and the inert gas to flow around the entire circumference of the socket;
• the supply mechanism communicates with the gap between the socket and the second cover structure;
• the socket is attached to the electrostatic chuck, and the plug is attached to a heater filter;
• and
• the socket and the second cover structure are supported such that the socket and the second cover structure are slidable relative to the electrostatic chuck in a direction that is orthogonal to a direction in which the plug is inserted into the socket.

A feeder-cover structure, comprising:

• a first power feeder including a first socket and a first plug fitted together;
• a second power feeder including a second socket and a second plug fitted together;
• a first cover structure for covering the first plug and the second plug;
• a first-socket cover structure for covering the first socket;
• a second-socket cover structure for covering the second socket, the first-socket cover structure being separate from the second-socket cover structure;
• a third cover structure that connects an upper end of the first-socket cover structure to an upper end of the second-socket cover structure;
• and
• a supply mechanism that supplies one of dry air and an inert gas, wherein
• the first cover structure is configured to also cover the first-socket cover structure and the second-socket cover structure;
• a first gap is formed between the first socket and the first-socket cover structure to surround an entire circumference of the first socket, the first gap allowing the one of the dry air and the inert gas to flow around the entire circumference of the first socket;
• a second gap is formed between the second socket and the second-socket cover structure to surround an entire circumference of the second socket, the second gap allowing the one of the dry air and the inert gas to flow around the entire circumference of the second socket;
• a path connecting the first gap and the second gap is formed by the third cover structure;
• the feeder-cover structure is configured such that the one of the dry air and the inert gas supplied from the supply mechanism flows through the first gap into the path connecting the first gap and the second gap, flows through the path into the second gap, and then flows through the second gap;
• the first socket and the second socket are attached to an electrostatic chuck;
• and
• the first socket, the second socket, the first-socket cover structure, and the second-socket cover structure are supported so as to be slidable relative to the electrostatic chuck in a direction that is orthogonal to a direction in which the first plug and the second plug are inserted into the first socket and the second socket.