Surface acoustic wave device and manufacturing method therefor
AssigneeMurata Manufacturing Co., Ltd.
InventorsDaisuke Ajima, Seiji Kai
Life of this patent
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AssigneeMurata Manufacturing Co., Ltd.
InventorsDaisuke Ajima, Seiji Kai
Estimating the term…
In a surface acoustic wave device, a conductor pattern is located on a main surface of a piezoelectric substrate and includes a surface acoustic wave element pattern, a pad and a feed line that is electrically connected to the pad and extends up to an outer peripheral edge of the main surface. The piezoelectric substrate and a cover are bonded to each other with a support layer therebetween that includes a frame extending along the outer peripheral edge of the main surface so that a gap is provided between the frame and the outer peripheral edge and includes a pad adjacent portion on the pad. Thus, a closed space is surrounded by the piezoelectric substrate, the cover and the frame. The support layer further includes a reinforcement portion that intersects a feed line at or near an intersection portion in which a separated portion of the frame that is separated from the pad adjacent portion intersects the feed line.
A surface acoustic wave device comprising:
Dependencies are inferred from the claim text.