Waterproof electronic packaging structure and method for making the same

A waterproof electronic packaging structure comprising:

• a carrier plate that includes a substrate, and a leadframe that is partly embedded in said substrate and includes a chip bonding portion exposed from said substrate;
• a chip that is mounted to said substrate and is electrically connected to said chip bonding portion of said leadframe;
• an encapsulating member that is formed on said carrier plate, and encapsulates said chip and said chip bonding portion;
• and
• a waterproof member that is formed on said encapsulating member, and covers an outer surface of said encapsulating member and an interface between said encapsulating member and said substrate,
• wherein said encapsulating member includes a main encapsulant layer that surrounds said chip and has a light opening uncovering a surface area of said chip, and a light-transmissible plate that is disposed on said main encapsulant layer and covers said light opening of said main encapsulant layer,
• wherein said waterproof member covers an outer surface of said main encapsulant layer, an interface between said main encapsulant layer and said substrate, and an interface between said light-transmissible plate and said main encapsulant layer, and
• wherein said waterproof member uncovers a surface area of said light-transmissible plate corresponding in position to said light opening.