Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same

A process of forming a semiconductor package substrate, comprising:

• seating a thin-film capacitor on a first build-up film;
• locating an inductor trace and a first magnetic-particle paste in a recess in an adjacent build up film;
• locating a subsequent complementary magnetic-particle paste adjacent the first magnetic particle paste, wherein the subsequent complementary magnetic-particle paste contacts the inductor trace;
• forming a land side and a die side that are coupled to the first and second and adjacent build-up films;
• and
• wherein the die side includes a die footprint that overlaps the thin-film capacitor and the magnetic inductor.

A computing system, comprising:

• a first build-up film of a semiconductor package substrate, wherein the first build-up film includes a first lithograph surface, and wherein the semiconductor package substrate includes a die side and a land side;
• a second and adjacent build-up film including a recess that abuts the first lithographic surface;
• a thin-film capacitor, wherein the thin-film capacitor is seated on the first lithographic surface, and partially embedded in the second and adjacent build-up film;
• a first capacitor via that communicates to the die side and that contacts the thin-film capacitor;
• a subsequent capacitor via that communicates to the die side and that contacts the thin-film capacitor;
• a subsequent thin-film capacitor, wherein the subsequent thin-film capacitor is seated on the first lithographic surface, and partially embedded in the second and adjacent build-up film;
• a magnetic inductor, wherein the magnetic inductor includes an inductor trace and a first magnetic-particle body within the recess, and a complementary magnetic-particle body that contacts the inductor trace, the first magnetic-particle body and the first build-up film;
• a semiconductive device contacting the die side, wherein the semiconductive device is coupled to the embedded thin-film capacitor and to the integral magnetic inductor, wherein the semiconductive device forms a die shadow on the die side, and wherein the die shadow overlaps the embedded thin-film capacitor and the integral magnetic inductor;
• and
• a board contacting the semiconductor package substrate at the land side.