Apparatus for multi-direct transfer of semiconductors

An apparatus comprising:

• a product substrate frame to secure a product substrate, the product substrate frame having a first side and a second side, the product substrate frame including a conveyance mechanism to which the product substrate is secured and via which a position of the product substrate is adjustable, the conveyance mechanism configured to convey the product substrate in at least two directions;
• a die substrate frame to secure a die substrate holding multiple semiconductor device dies, the die substrate frame being disposed adjacent to the first side of the product substrate frame;
• and
• a die separation device disposed adjacent to the die substrate frame to separate a semiconductor device die from the die substrate when the die substrate is secured in the die substrate frame, the die separation device including a plurality of independently actuatable pins configured to be pressed against the die substrate during a transfer operation.

An apparatus, comprising:

• a transfer mechanism to transfer a plurality of electrically-actuatable elements directly from a wafer tape to a transfer fixing location on a circuit trace, the transfer mechanism including a plurality of needles,
• wherein the transfer mechanism is configured to move a group of needles of the plurality of needles at a same time, the group of needles being two or more needles and less than all of the plurality of needles;
• a frame to hold the wafer tape, wherein the wafer tape includes a first side and a second side and the plurality of electrically-actuatable elements are disposed on the first side of the wafer tape;
• and
• a support member to support a product substrate having the circuit trace thereon, the support member including a conveyance mechanism to which the product substrate is secured and via which a position of the product substrate is adjustable, the support member being configured to hold the product substrate such that the circuit trace is disposed facing the plurality of electrically-actuatable elements on the wafer tape, the conveyance mechanism being configured to convey the product substrate in at least two directions.