Package structure and the method to fabricate thereof
AssigneeCyntec Co., Ltd.
InventorsJeng-Jen Li, Bau-Ru Lu
Life of this patent
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Abstract
The invention discloses a package structure with at least one portion of a first conductive element disposed in a through-opening of a first substrate. A conductive structure is disposed on the first substrate and the first conductive element, wherein the conductive structure is electrically connected to the first substrate and said at least one first I/O terminal of the first conductive element. The conductive structure comprises at least one of a second conductive element, a second substrate or a conductive pattern.
Claims12
A package structure, comprising:
- a first lead frame, having a top surface and a bottom surface and comprising a through-opening therein, wherein the through-opening is exposed from the top surface and the bottom surface of the first lead frame;
- a first electronic device, having at least one first I/O terminal on a top surface of the first electronic device, wherein at least one portion of the first electronic device is disposed in the through-opening of the first lead frame, wherein an insulating layer is disposed on the top surface of the first electronic device and the top surface of the first lead frame and extended into spaces between the first lead frame and the first electronic device in the through-opening;
- a conductive layer disposed on the insulating layer;
- and
- a second electronic device disposed above the top surface of the first lead frame and the top surface of the first electronic device, wherein the second electronic device is electrically connected to the first electronic device through the conductive layer, wherein a conductive pattern of the conductive layer electrically connects the first I/O terminal of the first electronic device to the top surface of the first lead frame through a via that is disposed in the insulating layer and located over the top surface of the first lead frame.
A connecting structure for connecting to an electronic device having a terminal, comprising:
- a pad disposed on the terminal of the electronic device;
- and
- a first metallic material permeating across the entire interface between the pad and the terminal of the electronic device, wherein the first metallic material is electrically connected to the terminal of the electronic device and encapsulates at least one portion of the pad.
A method for forming a connecting structure for connecting to an electronic device having a terminal, comprising the steps of:
- disposing a pad on the terminal of the electronic device;
- and
- permeating a first metallic material across the entire interface between the pad and the terminal of the electronic device, wherein the first metallic material is electrically connected to the terminal of the electronic device and encapsulates at least one portion of the pad.
Dependencies are inferred from the claim text.