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US 10,373,928 B1Granted
Method for electrically interconnecting at least two substrates and multichip module
AssigneeHypres, Inc.
InventorVladimir V. Dotsenko
Life of this patent
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AssigneeHypres, Inc.
InventorVladimir V. Dotsenko
Estimating the term…
A method for electrically interconnecting two substrates, each having a corresponding set of preformed electrical contacts, the substrates comprising an electronic circuit, and the resulting module, is provided. A liquid curable adhesive is provided over the set of contacts of a first substrate, and the set of electrical contacts of the second substrate is aligned with the set of electrical contacts of the first substrate. The sets of electrical contacts of the first and second substrate are compressed to displace the liquid curable adhesive from the inter-contact region, and provide electrical communication between the respective sets of electrical contacts. The liquid curable adhesive is then cured to form a solid matrix which maintains a relative compression between the respective sets of electrical contacts. One embodiment of the module comprises a high-speed superconducting circuit which operates at cryogenic temperatures.
A method for electrically interconnecting at least two substrates, each having corresponding sets of electrical contacts, at least one of the substrates having a set of electrical contacts formed of a deformable metal, comprising:
A method of forming a multichip module, comprising a first substrate having a first set of contacts in a first contact pattern, the first set of contacts being formed of a metal which is deformable under a contact pressure, and a second substrate having a second set of contacts in a second contact pattern, the second contact pattern corresponding to the first contact pattern, the method comprising:
A method of forming a multichip module, comprising:
Dependencies are inferred from the claim text.