Connection body and method of manufacturing connection body

A connection body comprising:

• a circuit board comprising a plurality of terminals arranged into a plurality of terminal rows, the plurality of terminal rows being arranged in parallel to one another in a widthwise direction orthogonal to a direction in which the plurality of terminals are arranged;
• and
• an electronic component comprising a plurality of bumps arranged into a plurality of bump rows corresponding to the plurality of terminal rows, the plurality of bump rows being arranged in parallel to one another in a widthwise direction orthogonal to a direction in which the plurality of bumps are arranged,
• wherein
• the electronic component is connected upon the circuit board interposed by an anisotropic conductive adhesive comprising electrically conductive particles arranged therein,
• a distance between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps arranged toward outer sides of the circuit board and the electronic component is greater than a distance between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps arranged toward inner sides of the circuit board and the electronic component, and
• the circuit board comprises:
• a first terminal region comprising a terminal row of the plurality of terminal rows formed in the first terminal region;
• and
• a second terminal region comprising a plurality of terminal rows of the plurality of terminal rows arranged in parallel to one another in a widthwise direction;
• the electronic component comprises
• a first bump region comprising a bump row of the plurality of bump rows formed in the first bump region;
• and
• a second bump region comprising a plurality of bump rows of the plurality of the bump rows arranged in parallel to one another in a widthwise direction;
• and
• a distance Do between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps arranged toward outer sides in the second terminal region and the second bump region of the circuit board and the electronic component is within 110% of an average distance dAVE of a distance between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps at both end portions of a terminal row of the plurality of terminal rows and a bump row of the plurality of bump rows arranged toward outer sides in the second terminal region and the second bump region of the circuit board and the electronic component, and a distance between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps at both end portions of the terminal row and the bump row in the first terminal region and the first bump region of the circuit board and the electronic component.

A connection body comprising:

• a circuit board comprising a plurality of terminals arranged into a plurality of terminal rows, the plurality of terminal rows being arranged in parallel to one another in a widthwise direction orthogonal to a direction in which the plurality of terminals are arranged;
• and
• an electronic component comprising a plurality of bumps arranged into a plurality of bump rows corresponding to the plurality of terminal rows, the plurality of bump rows being arranged in parallel to one another in a widthwise direction orthogonal to a direction in which the plurality of bumps are arranged,
• wherein
• the electronic component is connected upon the circuit board interposed by an anisotropic conductive adhesive comprising electrically conductive particles arranged therein,
• a distance between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps arranged toward outer sides of the circuit board and the electronic component is greater than a distance between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps arranged toward inner sides of the circuit board and the electronic component, and
• the plurality of bumps comprise concave and convex portions formed on bump surfaces that capture the electrically conductive particles, the concave and convex portions have a difference in elevation within 50% of a particle diameter of the electrically conductive particles.

A method of manufacturing a connection body, the connection body comprising:

• a circuit board comprising a plurality of terminals arranged into a plurality of terminal rows, the plurality of terminal rows being arranged in parallel to one another in a widthwise direction;
• and
• an electronic component comprising a plurality of bumps arranged into a plurality of bump rows corresponding to the plurality of terminal rows, the plurality of bump rows arranged in parallel to one another in a widthwise direction, the method comprising the steps of;
• mounting the electrical component onto the circuit board interposed by an anisotropic conductive adhesive comprising electrically conductive particles arranged therein;
• and
• pressing the electrical component while hardening the anisotropic conductive adhesive,
• wherein
• a distance between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps arranged toward outer sides of the circuit board and the electronic component is greater than a distance between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps arranged toward inner sides of the circuit board and the electronic component and
• a ratio D (=Do/Di) of a distance Do between mutually opposing the terminals and the bumps arranged toward the outer sides of the circuit board and the electronic component to a distance Di between mutually opposing the terminals and the bumps arranged toward the inner sides of the circuit board and the electronic component is within 130% of a ratio d (=do/di), at both ends of the plurality of bumps on the electronic component in a direction in which the plurality of bumps are arranged, of an average distance do between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps arranged toward the outer sides of the circuit board and the electronic component and an average distance di between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps arranged toward the inner sides of the circuit board and the electronic component.