Methods of manufacturing a multi-device package
AssigneeMicron Technology, Inc.
InventorsShih-Fan Kuan, Yi-Jen Lo
Life of this patent
Estimating the term…
Abstract
A multi-device package includes a substrate, at least two device regions, a first redistribution layer, an external chip and a plurality of first connectors. The two device regions are formed from the substrate, and the first redistribution layer is disposed on the substrate and electrically connected to the two device regions. The external chip is disposed on the first redistribution layer, and the first connectors are interposed between the first redistribution layer and the external chip to interconnect the two.
Claims9
A method of manufacturing a multi-device package, the method comprising:
- forming at least two device regions from a wafer and within the wafer by using material of the wafer;
- forming a first redistribution layer on the wafer, the first redistribution layer being electrically connected to the at least two device regions to electrically integrate the at least two device regions;
- forming a plurality of first connectors on the first redistribution layer;
- mounting an external chip on the plurality of first connectors, the external chip being electrically connected to the first redistribution layer by the plurality of first connectors;
- forming a plurality of second connectors on the first redistribution layer, a diameter of a second connector of the plurality of second connectors being larger than a sum of a diameter of a first connector of the plurality of first connectors and a thickness of the external chip;
- forming a temporary adhesive layer covering the plurality of second connectors and the external chip;
- thinning the wafer;
- removing the temporary adhesive layer;
- and
- thereafter dicing the wafer along a scribe line to form the multi-device package.
A method of manufacturing a multi-device package, the method comprising:
- forming at least two device regions from a wafer and within the wafer by using material of the wafer;
- forming a redistribution layer on the wafer, the redistribution layer being electrically connected to the at least two device regions to electrically integrate the at least two device regions;
- forming a plurality of connectors on the redistribution layer;
- mounting an external chip on the plurality of connectors, the external chip being electrically connected to the redistribution layer by the plurality of connectors;
- performing testing of individual devices comprising the at least two device regions;
- and
- thereafter dicing the wafer along a scribe line to form the multi-device package.
A method of manufacturing a multi-device package, the method comprising:
- forming at least two device regions from a wafer and within the wafer by using material of the wafer;
- forming a redistribution layer on the wafer, the redistribution layer being electrically connected to the at least two device regions to electrically integrate the at least two device regions, wherein forming the redistribution layer on the wafer comprises forming conductive pads recessed within the wafer, wherein the conductive pads form an uppermost metal layer of a metal interconnect structure of the first redistribution layer;
- forming a plurality of connectors on the redistribution layer;
- mounting an external chip on the plurality of connectors, the external chip being electrically connected to the redistribution layer by the plurality of connectors;
- and
- thereafter dicing the wafer along a scribe line to form the multi-device package.
Dependencies are inferred from the claim text.