Package substrate
OwnerDyi-Chung Huinventor
Life of this patent
Estimating the term…
Abstract
A package substrate is disclosed. The package substrate includes a molding layer, a redistribution structure, and a build-up structure. The redistribution structure is embedded in the molding layer with a surface exposed by the molding layer. The build-up structure is formed on the bottom surface of the molding layer. An inner stress caused by a CTE difference between different materials in the package substrate is reduced by forming at least one groove which is arranged around the periphery of the redistribution structure onto the top surface of the molding layer, thereby improving the problem of the redistribution structure cracking in the prior art.
Claims18
A package substrate, comprising:
- a redistribution structure having a plurality of top electrode pads, the plurality of top electrode pads being configured with a first density adaptive for a chip to mount thereon;
- a build-up layer configured on bottom of the redistribution structure, the build-up layer having a plurality of bottom mounting pads, the plurality of bottom mounting pads being configured with a second density adaptive for the substrate to mount onto a printed circuit board, the second density being lower than the first density;
- a molding layer embedding the redistribution structure therein;
- a groove extending around the redistribution structure;
- and
- a dielectric material filled in the groove,
- wherein
- the groove contains no conductive material,
- an open end surface of the groove is at the same height as a top surface of the redistribution structure,
- the top surface of the redistribution structure is a surface of the redistribution structure farthest away to the build-up layer,
- a depth of the groove is greater than an entire thickness of the redistribution structure,
- a first portion of the molding layer is interposed between the groove and the redistribution structure,
- the material of the dielectric material filled in the groove is different from the material of the molding layer, and
- a second portion of the molding layer is interposed, in a thickness direction of the package substrate, between the redistribution structure and the build-up layer.
A package substrate, comprising:
- a redistribution structure having a plurality of top electrode pads, the plurality of top electrode pads being configured with a first density;
- a build-up layer configured on bottom of the redistribution structure, the build-up layer having a plurality of bottom mounting pads, the plurality of bottom mounting pads being configured with a second density adaptive for the substrate to mount onto a printed circuit board, the second density being lower than the first density;
- a molding layer embedding the redistribution structure therein;
- and
- a groove extending around the redistribution structure,
- wherein
- an open end surface of the groove is at the same height as a top surface of the redistribution structure,
- the top surface of the redistribution structure is a surface of the redistribution structure farthest away from the build-up layer,
- a depth of the groove is greater than an entire thickness of the redistribution structure,
- the groove contains no conductive material, and
- the groove extends from a top surface of the molding layer, through an entire thickness of the molding layer, and into a portion of the build-up layer.
Dependencies are inferred from the claim text.