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US 10,373,917 B2Granted
Electronic circuit package using conductive sealing material
AssigneeTDK Corporation
InventorKenichi Kawabata
Life of this patent
Estimating the term…
Abstract
Disclosed herein is an electronic circuit package that includes a substrate having a power supply pattern, an electronic component mounted on a surface of the substrate; and a molding member having conductivity that covers the surface of the substrate so as to embed the electronic component therein. The power supply pattern includes a first power supply pattern exposed to the surface of the substrate, and the molding member contacts the first power supply pattern.
Claims29
An electronic circuit package comprising:
- a substrate having a power supply pattern;
- a plurality of electronic components mounted on a surface of the substrate;
- and
- a molding member that covers the surface of the substrate so as to embed the electronic components therein,
- wherein the molding member includes a first portion located above each of the electronic components and a second portion located between the electronic components, each of the first and second portions having conductivity;
- wherein the power supply pattern includes a first power supply pattern exposed to the surface of the substrate, and
- wherein the molding member contacts the first power supply pattern, thereby a predetermined potential is applied to each of the first and second portions of the molding member.
4 more elements
An electronic circuit package comprising:
- a substrate having a main surface;
- a first land pattern formed on the main surface of the substrate;
- a power supply pattern formed on the substrate;
- an electronic component mounted on the main surface of the substrate;
- and
- a molding member covering the main surface of the substrate so as to embed the electronic component therein,
- wherein the molding member includes a resin material and a plurality of fillers blended in the resin material, each surface of the plurality of fillers being covered with a metal material, and
- wherein the molding member contacts the first land pattern and the power supply pattern to thereby apply a predetermined potential to each of the first land pattern and the power supply pattern.
5 more elements
Dependencies are inferred from the claim text.