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US 10,373,916 B2Granted
Semiconductor device packages
AssigneeUniversal Scientific Industrial (Shanghai) Co., Ltd.
InventorsJi-Min Lin, Ming-Wen Liao, Chun-Ying Huang
Life of this patent
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Abstract
A semiconductor device package includes a substrate, a component on a surface of the substrate, a package body encapsulating the component, and an electromagnetic interference (EMI) shield conformally formed on the package body, where the EMI shield has a side portion defining an opening.
Claims19
A semiconductor device package comprising:
- a substrate having a top surface and a lateral surface perpendicular to the top surface;
- at least one component on the top surface of the substrate;
- a package body encapsulating the at least one component and having a lateral surface;
- and
- an electromagnetic interference (EMI) shield conformally formed on the package body and covering the lateral surface of the package body, the EMI shield having a first side portion defining a first opening;
- wherein the lateral surface of the package body covered by the EMI shield is substantially coplanar with the lateral surface of the substrate,
- the at least one component is configured to operate at a frequency of operation, and the EMI shield having the first opening is configured to shift a resonant frequency that corresponds to the frequency of operation of the at least one component, and
- the first opening has a first length L1 determined by 0.026λ≤L1≤0.155λ and λ is a wavelength related to the frequency of operation of the semiconductor device package, and the frequency of operation is in a range from approximately 5.180 GHz to approximately 5.825 GHz.
5 more elements
A semiconductor device package comprising:
- a substrate having a top surface and a lateral surface perpendicular to the top surface;
- a circuit on the top surface of the substrate, the circuit configured for operation at a first frequency;
- a package body encapsulating the circuit and having a lateral surface;
- and
- a conformal shield on the package body and covering the lateral surface of the package body, the conformal shield defining a first opening, wherein the conformal shield defining the first opening is configured to shift a resonant frequency that corresponds to the first frequency at which the circuit is configured for operation;
- wherein the lateral surface of the package body covered by the conformal shield is substantially coplanar with the lateral surface of the substrate, and
- the first opening has a first length L1 determined by 0.026λ≤L1≤0.155λ and λ is a wavelength related to the frequency of operation of the semiconductor device package, and the frequency of operation is in a range from approximately 5.180 GHz to approximately 5.825 GHz.
4 more elements
A semiconductor device package comprising:
- a substrate having a top surface and a lateral surface perpendicular to the top surface;
- at least one component on the top surface of the substrate;
- a package body encapsulating the at least one component and having a lateral surface;
- and
- an electromagnetic interference (EMI) shield conformally formed on the package body and covering the lateral surface of the package body, the EMI shield comprising an inductor structure;
- wherein the lateral surface of the package body covered by the EMI shield is substantially coplanar with the lateral surface of the substrate;
- the at least one component is configured to operate at a frequency of operation, and the EMI shield has at least one opening configured to shift a resonant frequency that corresponds to the frequency of operation of the at least one component, and
- the at least one opening has a first length L1 determined by 0.026λ≤L1≤0.155λ and λ is a wavelength related to the frequency of operation of the semiconductor device package, and the frequency of operation is in a range from approximately 5.180 GHz to approximately 5.825 GHz.
5 more elements
Dependencies are inferred from the claim text.