Method of marking a semiconductor package

A method of making a semiconductor device, comprising:

• providing a wafer comprising a plurality of semiconductor die, wherein each semiconductor die comprises an active surface and a backside opposite the active surface;
• forming a multi-layer material on the wafer and over a backside of each of the plurality of semiconductor die within the wafer with a coating machine, the multi-layer material comprising a non-photosensitive layer and a photosensitive layer;
• forming an identifying mark in the photosensitive layer of the multi-layer material for each of the plurality of semiconductor die while the multi-layer material is on the wafer, the identifying mark for each of the semiconductor die being formed by removing a portion of the photosensitive layer with a digital exposure machine and a developer, the identifying mark encoding unique product information;
• curing the photosensitive layer;
• and
• singulating the wafer into a plurality of semiconductor devices after forming the identifying mark in the photosensitive layer.

A method of making a semiconductor device, comprising:

• providing a wafer comprising a plurality of semiconductor die, wherein each semiconductor die comprises an active surface and a backside opposite the active surface;
• forming a multi-layer material comprising a non-photosensitive layer and a photosensitive layer, wherein the photosensitive layer is formed on the wafer and on each of the plurality of semiconductor die;
• and
• forming a unique identifying mark in the photosensitive layer of the multi-layer material with a maskless patterning system for each of the plurality of semiconductor die while the multi-layer material is on the wafer, forming the unique identifying mark for each of the plurality of semiconductor die by removing a portion of the photosensitive layer without laser ablation, the unique identifying mark encoding unique product information.