Laminate and making method
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsHiroyuki Yasuda, Michihiro Sugo, Hideto Kato, Kazunori Kondo
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Abstract
A laminate is provided comprising a support, a resin layer, a metal layer, an insulating layer, and a redistribution layer. The resin layer comprises a photo-decomposable resin having light-shielding properties and has a transmittance of up to 20% with respect to light of wavelength 355 nm. The laminate is easy to fabricate and has thermal process resistance, the support is easily separated, and a semiconductor package is efficiently produced.
Claims6
A laminate comprising a support, a resin layer formed on the support, a metal layer formed on the resin layer, an insulating layer and a redistribution layer formed on the metal layer, the resin layer comprising a photo-decomposable resin having light-shielding properties and having a transmittance of up to 20% with respect to light of wavelength 355 nm,
- wherein the resin having light-shielding properties contains a fused ring in the main chain.
Dependencies are inferred from the claim text.