Semiconductor structure and manufacturing method thereof

A semiconductor structure, comprising:

• a first substrate including a first surface and a second surface opposite to the first surface;
• a second substrate including a third surface and a fourth surface opposite to the third surface;
• a polymeric layer disposed between the second surface of the first substrate and the third surface of the second substrate;
• a conductive line embedded in the polymeric layer;
• a plurality of first conductive vias extending through the first substrate, the polymeric layer and the second substrate, the plurality of first conductive vias configured to connect to a signal source and spaced from each other by a first distance;
• and
• a plurality of second conductive vias extended through the first substrate, the polymeric layer and the second substrate, the plurality of second conductive vias configured to connected to an electrical ground and each spaced from one of the plurality of first conductive vias by a second distance smaller than the first distance, wherein each of the plurality of first conductive vias is separated from another of the plurality of first conductive via by one of the plurality of second conductive via.

A semiconductor structure, comprising:

• a first substrate including a first surface and a second surface opposite to the first surface;
• a second substrate including a third surface and a fourth surface opposite to the third surface;
• a polymeric layer disposed between the second surface of the first substrate and the third surface of the second substrate;
• a conductive line embedded in the polymeric layer;
• a first conductive via including a first via and a second via;
• a second conductive via including a third via and a fourth via;
• and
• a third conductive via including a fifth via and a sixth via,
• wherein the first via is disposed over the second via, the third via is disposed over the fourth via, the fifth via is disposed over the sixth via, the first via, the third via and the fifth via are respectively extended through the first substrate or the second substrate, the second via, the fourth via and the sixth via are respectively extended through the polymeric layer, the second conductive via is disposed between the first conductive via and the third conductive via, the second conductive via is configured to connect to a signal source, and the first conductive via and the third conductive via are configured to connect to an electrical ground.