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US 10,373,898 B2Granted
Semiconductor device and method of manufacturing the same
AssigneeMitsubishi Electric Corporation
InventorsYuji Iwai, Katsumi Miyawaki
Life of this patent
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Abstract
A semiconductor device includes a lead frame comprising a first terminal and a second terminal for grounding, a sealing resin which covers the lead frame, an exposed part which is a part of the second terminal and is exposed from the sealing resin and a conductive material which covers the surface of the sealing resin and contacts the second terminal at the exposed part.
Claims11
A semiconductor device comprising:
- a lead frame comprising at least one first terminal and at least one second terminal for grounding;
- a sealing resin covering the lead frame and defining an end of the semiconductor device, the sealing resin comprising a thin wall part above the at least one first terminal, the thin wall part having a height equal to a height of the at least one second terminal at the end of the semiconductor device;
- an exposed part which is a part of the at least one second terminal and is exposed from the sealing resin;
- and
- a conductive material which covers the surface of the sealing resin and contacts the at least one second terminal at the exposed part, wherein
- a first notch portion is provided in the at least one second terminal at the end of the semiconductor device, and a second notch portion is provided at the thin wall part and above the at least one first terminal, and
- the conductive material contacts the at least one second terminal in the first notch portion.
4 more elements
Dependencies are inferred from the claim text.