Semiconductor devices with improved thermal and electrical performance

A device, comprising:

• a carrier;
• a semiconductor chip arranged over a first surface of the carrier;
• an encapsulation body comprising six side surfaces and encapsulating the semiconductor chip, wherein a second surface of the carrier opposite to the first surface of the carrier is exposed from the encapsulation body;
• electrical contact elements electrically coupled to the semiconductor chip and protruding out of the encapsulation body exclusively through two opposing side surfaces of the encapsulation body which have the smallest surface areas of all the side surfaces of the encapsulation body;
• a first material deposited over one or more of the electrical contact elements;
• and a second material deposited over the exposed second surface of the carrier;
• and wherein the first material is a solder-wettable material, and wherein the second material is a solder non-wettable material.